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Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

机译：微量元素对两种无铅焊料与铜或镍基板界面反应的影响

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Soares D.; Vilarinho C.; Barbosa J.; Samuel F.; Trigo L.; Bré P.;
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年度 2007
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1. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates [J] . Soares D., Vilarinho C., Barbosa J., Journal of Mining and Metallurgy, Section B: Metallurgy . 2007,第2期

机译：微量元素对两种无铅焊料与铜或镍基底之间的界面反应的影响
2. Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder [J] . D. Soares, C. Vilarinho, J. Barbosa, Revista de metalurgia . 2005,第Sup期

机译：铋含量对铜基体与Sn-Zn-Al-Bi无铅焊料之间界面反应的影响
3. Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time [J] . Mrunali Sona, K. Narayan Prabhu Transactions of the Indian Institute of Metals . 2015,第6期

机译：Sn-0.3Ag-0.7Cu无铅锡合金在镀镍铜基底上的扩散行为和接头可靠性与回流时间的关系
4. EFFECT OF COPPER CONCENTRATION ON THE SOLID-STATE AGING REACTIONS BETWEEN TIN-COPPER LEAD-FREE SOLDERS AND NICKEL [C] . W. T. Chen, R. Y. Tsai, Y. L. Lin, Proceedings of the Technical Program . 2002

机译：铜浓度对无锡锡铜焊料和镍之间的固态时效反应的影响
5. Wetting kinetics and interfacial reaction of lead-based and lead-free solder alloys on copper and nickel metallizations in electronic packaging. [D] . Kim, Harqkyun. 1996

机译：铅基和无铅焊料合金在电子包装中铜和镍金属上的润湿动力学和界面反应。
6. Trace Element Status (Iron Zinc Copper Chromium Cobalt and Nickel) in Iron-Deficiency Anaemia of Children under 3 Years [O] . Maria Georgieva Angelova, Tsvetelina Valentinova Petkova-Marinova, Maksym Vladimirovich Pogorielov, 2014

机译：3岁以下儿童缺铁性贫血中的微量元素状态（铁锌铜铬钴和镍）
7. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates [O] . Soares D., Vilarinho C., Barbosa J., 2007

机译：微量元素对两种无铅焊料与铜或镍基板界面反应的影响

Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

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